github - ghsa-m528-9cvr-fx99

ghsa-m528-9cvr-fx99

Vulnerability from github

Published

2022-05-14 01:51

Modified

2022-05-14 01:51

Severity ?

7.8 (High) - CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.

Show details on source website

JSON

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{
  "affected": [],
  "aliases": [
    "CVE-2017-18297"
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-415"
    ],
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2018-10-23T13:29:00Z",
    "severity": "HIGH"
  },
  "details": "Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.",
  "id": "GHSA-m528-9cvr-fx99",
  "modified": "2022-05-14T01:51:55Z",
  "published": "2022-05-14T01:51:55Z",
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2017-18297"
    },
    {
      "type": "WEB",
      "url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins"
    },
    {
      "type": "WEB",
      "url": "http://www.securitytracker.com/id/1041432"
    }
  ],
  "schema_version": "1.4.0",
  "severity": [
    {
      "score": "CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
      "type": "CVSS_V3"
    }
  ]
}

cve-2017-18297

Vulnerability from cvelistv5

Published

2018-10-23 13:00

Modified

2024-08-05 21:20

Severity ?

Summary

Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.

References

▼	URL	Tags
	https://www.qualcomm.com/company/product-security/bulletins	x_refsource_CONFIRM
	http://www.securitytracker.com/id/1041432	vdb-entry, x_refsource_SECTRACK
	https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components	x_refsource_CONFIRM

Impacted products

Vendor

Product

Version

▼

Qualcomm, Inc.

Snapdragon Mobile

Version: SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820

Show details on NVD website

JSON

To clipboard

{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-05T21:20:50.229Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins"
          },
          {
            "name": "1041432",
            "tags": [
              "vdb-entry",
              "x_refsource_SECTRACK",
              "x_transferred"
            ],
            "url": "http://www.securitytracker.com/id/1041432"
          },
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Mobile",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820"
            }
          ]
        }
      ],
      "datePublic": "2018-08-06T00:00:00",
      "descriptions": [
        {
          "lang": "en",
          "value": "Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820."
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Double Free in Trusted Application Environment",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2018-10-24T09:57:01",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins"
        },
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          "name": "1041432",
          "tags": [
            "vdb-entry",
            "x_refsource_SECTRACK"
          ],
          "url": "http://www.securitytracker.com/id/1041432"
        },
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2017-18297",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Mobile",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
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              "value": "Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820."
            }
          ]
        },
        "problemtype": {
          "problemtype_data": [
            {
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                {
                  "lang": "eng",
                  "value": "Double Free in Trusted Application Environment"
                }
              ]
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          ]
        },
        "references": {
          "reference_data": [
            {
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              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins"
            },
            {
              "name": "1041432",
              "refsource": "SECTRACK",
              "url": "http://www.securitytracker.com/id/1041432"
            },
            {
              "name": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components",
              "refsource": "CONFIRM",
              "url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2017-18297",
    "datePublished": "2018-10-23T13:00:00",
    "dateReserved": "2018-06-15T00:00:00",
    "dateUpdated": "2024-08-05T21:20:50.229Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}

Sightings

Author	Source	Type	Date

Nomenclature

Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
Confirmed: The vulnerability is confirmed from an analyst perspective.
Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
Patched: This vulnerability was successfully patched by the user reporting the sighting.
Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
Not confirmed: The user expresses doubt about the veracity of the vulnerability.
Not patched: This vulnerability was not successfully patched by the user reporting the sighting.

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