github - ghsa-35m9-g697-gr77

ghsa-35m9-g697-gr77

Vulnerability from github

Published

2022-05-14 01:07

Modified

2022-05-14 01:07

Severity ?

7.8 (High) - CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Details

Lack of buffer length check before copying in WLAN function while processing FIPS event, can lead to a buffer overflow in Snapdragon Mobile in version SD 845.

Show details on source website

JSON

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{
  "affected": [],
  "aliases": [
    "CVE-2018-11867"
  ],
  "database_specific": {
    "cwe_ids": [
      "CWE-119"
    ],
    "github_reviewed": false,
    "github_reviewed_at": null,
    "nvd_published_at": "2018-10-29T18:29:00Z",
    "severity": "HIGH"
  },
  "details": "Lack of buffer length check before copying in WLAN function while processing FIPS event, can lead to a buffer overflow in Snapdragon Mobile in version SD 845.",
  "id": "GHSA-35m9-g697-gr77",
  "modified": "2022-05-14T01:07:00Z",
  "published": "2022-05-14T01:07:00Z",
  "references": [
    {
      "type": "ADVISORY",
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2018-11867"
    },
    {
      "type": "WEB",
      "url": "https://www.qualcomm.com/company/product-security/bulletins"
    },
    {
      "type": "WEB",
      "url": "http://www.securityfocus.com/bid/107681"
    }
  ],
  "schema_version": "1.4.0",
  "severity": [
    {
      "score": "CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
      "type": "CVSS_V3"
    }
  ]
}

cve-2018-11867

Vulnerability from cvelistv5

Published

2018-10-29 18:00

Modified

2024-08-05 08:24

Severity ?

Summary

Lack of buffer length check before copying in WLAN function while processing FIPS event, can lead to a buffer overflow in Snapdragon Mobile in version SD 845.

References

▼	URL	Tags
	https://www.qualcomm.com/company/product-security/bulletins	x_refsource_CONFIRM
	http://www.securityfocus.com/bid/107681	vdb-entry, x_refsource_BID

Impacted products

Vendor

Product

Version

▼

Qualcomm, Inc.

Snapdragon Mobile

Version: SD 845

Show details on NVD website

JSON

To clipboard

{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-05T08:24:02.207Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins"
          },
          {
            "name": "107681",
            "tags": [
              "vdb-entry",
              "x_refsource_BID",
              "x_transferred"
            ],
            "url": "http://www.securityfocus.com/bid/107681"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Mobile",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "SD 845"
            }
          ]
        }
      ],
      "datePublic": "2018-10-29T00:00:00",
      "descriptions": [
        {
          "lang": "en",
          "value": "Lack of buffer length check before copying in WLAN function while processing FIPS event, can lead to a buffer overflow in Snapdragon Mobile in version SD 845."
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Buffer Copy Without Checking Size of Input in WLAN",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2019-04-03T10:06:06",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins"
        },
        {
          "name": "107681",
          "tags": [
            "vdb-entry",
            "x_refsource_BID"
          ],
          "url": "http://www.securityfocus.com/bid/107681"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2018-11867",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Mobile",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "SD 845"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "Lack of buffer length check before copying in WLAN function while processing FIPS event, can lead to a buffer overflow in Snapdragon Mobile in version SD 845."
            }
          ]
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Buffer Copy Without Checking Size of Input in WLAN"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins"
            },
            {
              "name": "107681",
              "refsource": "BID",
              "url": "http://www.securityfocus.com/bid/107681"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2018-11867",
    "datePublished": "2018-10-29T18:00:00",
    "dateReserved": "2018-06-07T00:00:00",
    "dateUpdated": "2024-08-05T08:24:02.207Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}

Sightings

Author	Source	Type	Date

Nomenclature

Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
Confirmed: The vulnerability is confirmed from an analyst perspective.
Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
Patched: This vulnerability was successfully patched by the user reporting the sighting.
Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
Not confirmed: The user expresses doubt about the veracity of the vulnerability.
Not patched: This vulnerability was not successfully patched by the user reporting the sighting.

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