cve-2023-21639
Vulnerability from cvelistv5
Published
2023-07-04 04:46
Modified
2024-08-02 09:44
Severity ?
6.7 (Medium) - CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Summary
Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client.
References
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletinVendor Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletinVendor Advisory
Impacted products
Vendor Product Version
Qualcomm, Inc. Snapdragon Version: AQT1000
Version: FastConnect 6200
Version: QCA6420
Version: QCA6430
Version: SA4150P
Version: SA4155P
Version: SA6155P
Version: SA8155P
Version: SA8195P
Version: SD855
Version: Snapdragon 855 Mobile Platform
Version: Snapdragon 855+/860 Mobile Platform (SM8150-AC)
Version: Snapdragon W5+ Gen 1 Wearable Platform
Version: SW5100
Version: SW5100P
Version: WCD9341
Version: WCN3980
Version: WCN3988
Version: WSA8810
Version: WSA8815
Version: WSA8830
Version: WSA8835
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{
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\"integrityImpact\": \"HIGH\", \"userInteraction\": \"NONE\", \"attackComplexity\": \"LOW\", \"availabilityImpact\": \"HIGH\", \"privilegesRequired\": \"HIGH\", \"confidentialityImpact\": \"HIGH\"}, \"scenarios\": [{\"lang\": \"en\", \"value\": \"GENERAL\"}]}], \"affected\": [{\"vendor\": \"Qualcomm, Inc.\", \"product\": \"Snapdragon\", \"versions\": [{\"status\": \"affected\", \"version\": \"AQT1000\"}, {\"status\": \"affected\", \"version\": \"FastConnect 6200\"}, {\"status\": \"affected\", \"version\": \"QCA6420\"}, {\"status\": \"affected\", \"version\": \"QCA6430\"}, {\"status\": \"affected\", \"version\": \"SA4150P\"}, {\"status\": \"affected\", \"version\": \"SA4155P\"}, {\"status\": \"affected\", \"version\": \"SA6155P\"}, {\"status\": \"affected\", \"version\": \"SA8155P\"}, {\"status\": \"affected\", \"version\": \"SA8195P\"}, {\"status\": \"affected\", \"version\": \"SD855\"}, {\"status\": \"affected\", \"version\": \"Snapdragon 855 Mobile Platform\"}, {\"status\": \"affected\", \"version\": \"Snapdragon 855+/860 Mobile Platform (SM8150-AC)\"}, {\"status\": \"affected\", \"version\": \"Snapdragon W5+ Gen 1 Wearable Platform\"}, {\"status\": \"affected\", \"version\": \"SW5100\"}, {\"status\": \"affected\", \"version\": \"SW5100P\"}, {\"status\": \"affected\", \"version\": \"WCD9341\"}, {\"status\": \"affected\", \"version\": \"WCN3980\"}, {\"status\": \"affected\", \"version\": \"WCN3988\"}, {\"status\": \"affected\", \"version\": \"WSA8810\"}, {\"status\": \"affected\", \"version\": \"WSA8815\"}, {\"status\": \"affected\", \"version\": \"WSA8830\"}, {\"status\": \"affected\", \"version\": \"WSA8835\"}], \"platforms\": [\"Snapdragon Auto\", \"Snapdragon Mobile\", \"Snapdragon Wearables\"], \"defaultStatus\": \"unaffected\"}], \"references\": [{\"url\": \"https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin\"}], \"descriptions\": [{\"lang\": \"en\", \"value\": \"Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client.\"}], \"problemTypes\": [{\"descriptions\": [{\"lang\": \"en\", \"type\": \"CWE\", \"cweId\": \"CWE-120\", \"description\": \"CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow')\"}]}], \"providerMetadata\": {\"orgId\": \"2cfc7d3e-20d3-47ac-8db7-1b7285aff15f\", \"shortName\": \"qualcomm\", \"dateUpdated\": \"2024-04-12T16:24:48.892Z\"}}}",
         cveMetadata: "{\"cveId\": \"CVE-2023-21639\", \"state\": \"PUBLISHED\", \"dateUpdated\": \"2024-08-02T09:44:01.890Z\", \"dateReserved\": \"2022-12-07T02:58:25.866Z\", \"assignerOrgId\": \"2cfc7d3e-20d3-47ac-8db7-1b7285aff15f\", \"datePublished\": \"2023-07-04T04:46:35.233Z\", \"assignerShortName\": \"qualcomm\"}",
         dataType: "CVE_RECORD",
         dataVersion: "5.1",
      },
   },
}


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