CVE-2014-9998 (GCVE-0-2014-9998)
Vulnerability from cvelistv5
Published
2018-04-18 14:00
Modified
2024-09-17 04:29
Severity ?
CWE
  • Buffer overflow vulnerability while processing firmware image signature
Summary
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, QCA4531, QCA6174A, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, QCA9558, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 625, SD 808, SD 810, SD 820, and SDX20, while processing firmware image signature, the internal buffer may overflow if the firmware signature size is large.
References
product-security@qualcomm.comhttp://www.securityfocus.com/bid/103671Third Party Advisory, VDB Entry
product-security@qualcomm.comhttps://source.android.com/security/bulletin/2018-04-01Vendor Advisory
af854a3a-2127-422b-91ae-364da2661108http://www.securityfocus.com/bid/103671Third Party Advisory, VDB Entry
af854a3a-2127-422b-91ae-364da2661108https://source.android.com/security/bulletin/2018-04-01Vendor Advisory
Impacted products
Vendor Product Version
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Version: IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, QCA4531, QCA6174A, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, QCA9558, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 625, SD 808, SD 810, SD 820, SDX20
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  }
}


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  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
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