cve-2022-33292
Vulnerability from cvelistv5
Published
2023-05-02 05:08
Modified
2024-08-03 08:01
Summary
Use after free in Qualcomm IPC
Impacted products
Vendor Product Version
Show details on NVD website


{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-03T08:01:20.553Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "defaultStatus": "unaffected",
          "platforms": [
            "Snapdragon Compute",
            "Snapdragon Mobile"
          ],
          "product": "Snapdragon",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "SG4150P"
            },
            {
              "status": "affected",
              "version": "Snapdragon 680 4G Mobile Platform"
            },
            {
              "status": "affected",
              "version": "Snapdragon 685 4G Mobile Platform (SM6225-AD)"
            },
            {
              "status": "affected",
              "version": "WCD9370"
            },
            {
              "status": "affected",
              "version": "WCD9375"
            },
            {
              "status": "affected",
              "version": "WCN3950"
            },
            {
              "status": "affected",
              "version": "WCN3988"
            },
            {
              "status": "affected",
              "version": "WSA8810"
            }
          ]
        }
      ],
      "descriptions": [
        {
          "lang": "en",
          "value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."
        }
      ],
      "metrics": [
        {
          "cvssV3_1": {
            "attackComplexity": "LOW",
            "attackVector": "LOCAL",
            "availabilityImpact": "HIGH",
            "baseScore": 7.8,
            "baseSeverity": "HIGH",
            "confidentialityImpact": "HIGH",
            "integrityImpact": "HIGH",
            "privilegesRequired": "LOW",
            "scope": "UNCHANGED",
            "userInteraction": "NONE",
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          },
          "format": "CVSS",
          "scenarios": [
            {
              "lang": "en",
              "value": "GENERAL"
            }
          ]
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "cweId": "CWE-416",
              "description": "CWE-416 Use After Free",
              "lang": "en",
              "type": "CWE"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2024-04-12T16:27:33.874Z",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"
        }
      ],
      "title": "Use after free in Qualcomm IPC"
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2022-33292",
    "datePublished": "2023-05-02T05:08:45.337Z",
    "dateReserved": "2022-06-14T10:44:39.610Z",
    "dateUpdated": "2024-08-03T08:01:20.553Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1",
  "meta": {
    "nvd": "{\"cve\":{\"id\":\"CVE-2022-33292\",\"sourceIdentifier\":\"product-security@qualcomm.com\",\"published\":\"2023-05-02T06:15:09.757\",\"lastModified\":\"2024-11-21T07:08:05.440\",\"vulnStatus\":\"Modified\",\"cveTags\":[],\"descriptions\":[{\"lang\":\"en\",\"value\":\"Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.\"}],\"metrics\":{\"cvssMetricV31\":[{\"source\":\"product-security@qualcomm.com\",\"type\":\"Secondary\",\"cvssData\":{\"version\":\"3.1\",\"vectorString\":\"CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H\",\"baseScore\":7.8,\"baseSeverity\":\"HIGH\",\"attackVector\":\"LOCAL\",\"attackComplexity\":\"LOW\",\"privilegesRequired\":\"LOW\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"HIGH\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"HIGH\"},\"exploitabilityScore\":1.8,\"impactScore\":5.9},{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"3.1\",\"vectorString\":\"CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H\",\"baseScore\":7.8,\"baseSeverity\":\"HIGH\",\"attackVector\":\"LOCAL\",\"attackComplexity\":\"LOW\",\"privilegesRequired\":\"LOW\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"HIGH\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"HIGH\"},\"exploitabilityScore\":1.8,\"impactScore\":5.9}]},\"weaknesses\":[{\"source\":\"product-security@qualcomm.com\",\"type\":\"Secondary\",\"description\":[{\"lang\":\"en\",\"value\":\"CWE-416\"}]},{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"description\":[{\"lang\":\"en\",\"value\":\"CWE-416\"}]}],\"configurations\":[{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"9279F02F-6C30-4891-8941-97003DE9C8C7\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sg4150p:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"FFA7BB42-305C-451F-92D8-0718DF68A012\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sm6225_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"EC2668D5-623D-4E13-AF37-6F7040A14007\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sm6225:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"72B0F4C7-CA0F-4B9C-A6AA-60934B2AB2C2\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E089DC83-3849-4671-95B9-E4C958EC79FB\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sm6225-ad:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E38F8F04-F841-492B-A555-96DBD7461380\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"1295D869-F4DD-4766-B4AA-3513752F43B4\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:wcd9370:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B98784DC-3143-4D38-AD28-DBBDCCAB4272\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"34143ABA-7D09-429F-A65C-3A33438BF62C\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:wcd9375:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"9D56DFE3-5EF1-4B23-BBD5-0203FBF9CCEC\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"3FEF2DB6-00F5-4B07-953B-EF58B31267F1\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:wcn3950:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"120E8F0F-EBEB-4565-9927-2D473F783EF7\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E4BFB25F-013B-48E3-99FF-3E8687F94423\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"BF676C5B-838B-446C-A689-6A25AB8A87E2\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"15307882-7039-43E9-9BA3-035045988B99\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:wsa8810:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"AA85B322-E593-4499-829A-CC6D70BAE884\"}]}]}],\"references\":[{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Patch\",\"Vendor Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Patch\",\"Vendor Advisory\"]}]}}"
  }
}


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  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
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