cve-2019-10569
Vulnerability from cvelistv5
Published
2020-03-05 08:56
Modified
2024-08-04 22:24
Severity ?
EPSS score ?
Summary
Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
References
Impacted products
Vendor | Product | Version | |
---|---|---|---|
▼ | Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile |
Version: APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 |
|
{ "containers": { "adp": [ { "providerMetadata": { "dateUpdated": "2024-08-04T22:24:18.716Z", "orgId": "af854a3a-2127-422b-91ae-364da2661108", "shortName": "CVE" }, "references": [ { "tags": [ "x_refsource_CONFIRM", "x_transferred" ], "url": "https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin" } ], "title": "CVE Program Container" } ], "cna": { "affected": [ { "product": "Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile", "vendor": "Qualcomm, Inc.", "versions": [ { "status": "affected", "version": "APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130" } ] } ], "descriptions": [ { "lang": "en", "value": "Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130" } ], "problemTypes": [ { "descriptions": [ { "description": "Stack Based Buffer Overflow Issue in Audio", "lang": "en", "type": "text" } ] } ], "providerMetadata": { "dateUpdated": "2020-03-05T08:56:05", "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "shortName": "qualcomm" }, "references": [ { "tags": [ "x_refsource_CONFIRM" ], "url": "https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin" } ], "x_legacyV4Record": { "CVE_data_meta": { "ASSIGNER": "product-security@qualcomm.com", "ID": "CVE-2019-10569", "STATE": "PUBLIC" }, "affects": { "vendor": { "vendor_data": [ { "product": { "product_data": [ { "product_name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile", "version": { "version_data": [ { "version_value": "APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130" } ] } } ] }, "vendor_name": "Qualcomm, Inc." } ] } }, "data_format": "MITRE", "data_type": "CVE", "data_version": "4.0", "description": { "description_data": [ { "lang": "eng", "value": "Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130" } ] }, "problemtype": { "problemtype_data": [ { "description": [ { "lang": "eng", "value": "Stack Based Buffer Overflow Issue in Audio" } ] } ] }, "references": { "reference_data": [ { "name": "https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin", "refsource": "CONFIRM", "url": "https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin" } ] } } } }, "cveMetadata": { "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "assignerShortName": "qualcomm", "cveId": "CVE-2019-10569", "datePublished": "2020-03-05T08:56:05", "dateReserved": "2019-03-29T00:00:00", "dateUpdated": "2024-08-04T22:24:18.716Z", "state": "PUBLISHED" }, "dataType": "CVE_RECORD", "dataVersion": "5.1", "meta": { "nvd": "{\"cve\":{\"id\":\"CVE-2019-10569\",\"sourceIdentifier\":\"product-security@qualcomm.com\",\"published\":\"2020-03-05T09:15:15.797\",\"lastModified\":\"2024-11-21T04:19:28.580\",\"vulnStatus\":\"Modified\",\"cveTags\":[],\"descriptions\":[{\"lang\":\"en\",\"value\":\"Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130\"},{\"lang\":\"es\",\"value\":\"Un desbordamiento del b\u00fafer de la pila debido a que el id de la instancia est\u00e1 colocado inapropiadamente dentro de la definici\u00f3n de los efectos acelerados del hardware en makefile en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile en las versiones APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130.\"}],\"metrics\":{\"cvssMetricV31\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"3.1\",\"vectorString\":\"CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H\",\"baseScore\":7.8,\"baseSeverity\":\"HIGH\",\"attackVector\":\"LOCAL\",\"attackComplexity\":\"LOW\",\"privilegesRequired\":\"LOW\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"HIGH\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"HIGH\"},\"exploitabilityScore\":1.8,\"impactScore\":5.9}],\"cvssMetricV2\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"2.0\",\"vectorString\":\"AV:L/AC:L/Au:N/C:C/I:C/A:C\",\"baseScore\":7.2,\"accessVector\":\"LOCAL\",\"accessComplexity\":\"LOW\",\"authentication\":\"NONE\",\"confidentialityImpact\":\"COMPLETE\",\"integrityImpact\":\"COMPLETE\",\"availabilityImpact\":\"COMPLETE\"},\"baseSeverity\":\"HIGH\",\"exploitabilityScore\":3.9,\"impactScore\":10.0,\"acInsufInfo\":false,\"obtainAllPrivilege\":false,\"obtainUserPrivilege\":false,\"obtainOtherPrivilege\":false,\"userInteractionRequired\":false}]},\"weaknesses\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"description\":[{\"lang\":\"en\",\"value\":\"CWE-787\"}]}],\"configurations\":[{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B052615D-857A-46D4-9098-1CBFA14687C6\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"19B59B60-A298-4A56-A45A-E34B7AAB43D7\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"13A7328A-89FB-4E9C-B4E3-D8097443FB7A\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:apq8098:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"678A68E0-81D8-4562-826E-03872184256C\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"A35FECFB-60AE-42A8-BCBB-FEA7D5826D49\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E9765187-8653-4D66-B230-B2CE862AC5C0\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"7FD1C359-C79B-4CE8-A192-5AA34D0BF05B\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"716B747E-672C-4B95-9D8E-1262338E67EA\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0E9154AF-E52E-4E84-9322-2CA7EBD3E6FE\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:msm8998:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"4796F9BD-61B3-45ED-B5E3-B061887285E2\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B05FD66D-13A6-40E9-A64B-E428378F237E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"D0D665C1-3EBA-42F2-BF56-55E6C365F7DF\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"30A45C1A-C921-42B5-9237-367245023B45\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sc8180x:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"56C9D979-F214-4CD4-8CF9-43BC804BB179\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"84289E6D-DA2A-4D04-9DDA-E8C46DDDD056\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"C0B56360-7AC3-410A-B7F8-1BE8514B3781\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"8EA0D645-80F6-48C3-AF0D-99198ADC8778\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"814FF3F3-CD5A-45A3-988C-6457D2CEB48C\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"8F00D854-0AC7-415F-B19A-642CB9F72210\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"F977B432-2709-4D75-AA3E-F440285B7BA2\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"24D7B67C-6FEC-48F8-9D46-778E4528BC20\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"05006807-D961-446C-B8DC-C87507F1316E\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"DED4B719-53B5-4D16-B3FA-ADE29D28ED86\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdm845:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"D342C86B-E184-457C-9F72-BD853ED79425\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"F9BE864E-7B1E-44D5-A10A-60078095DE33\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdx24:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"96DD6B48-2554-464D-A061-DBB4B8E00758\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E93FB34B-3674-404D-9687-E092E9A246AB\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sdx55:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"F3FF5A9A-A34A-499C-B6E0-D67B496C5454\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"8ABE492A-3755-4969-9DEB-4B85EBB84644\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sm6150:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E3D3787B-6ACC-4591-B041-01307ED66C36\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"F63A748F-2236-4486-83F1-DE4BCBE5D56D\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sm7150:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"184F3DFC-27E8-48AC-B46C-C589DBCBF030\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"9286B1E8-E39F-4DAA-8969-311CA2A0A8AA\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sm8150:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"19B9AE36-87A9-4EE7-87C8-CCA2DCF51039\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"096F7BA5-FF58-416B-93EF-733B16326C86\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sxr1130:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"7AF958FB-1611-4102-A2DB-8D4311AE0D72\"}]}]}],\"references\":[{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Patch\",\"Vendor Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Patch\",\"Vendor Advisory\"]}]}}" } }
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Sightings
Author | Source | Type | Date |
---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
- Confirmed: The vulnerability is confirmed from an analyst perspective.
- Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
- Patched: This vulnerability was successfully patched by the user reporting the sighting.
- Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
- Not confirmed: The user expresses doubt about the veracity of the vulnerability.
- Not patched: This vulnerability was not successfully patched by the user reporting the sighting.