Vulnerabilites related to qualcomm - s5_gen_2_sound_platform_firmware
Vulnerability from fkie_nvd
Published
2025-09-24 16:15
Modified
2025-09-25 16:04
Severity ?
Summary
Memory corruption due to global buffer overflow when a test command uses an invalid payload type.
References
Impacted products
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CVE-2025-47317 (GCVE-0-2025-47317)
Vulnerability from cvelistv5
Published
2025-09-24 15:33
Modified
2025-09-25 03:55
Severity ?
VLAI Severity ?
EPSS score ?
CWE
- CWE-126 - Buffer Over-read
Summary
Memory corruption due to global buffer overflow when a test command uses an invalid payload type.
References
Impacted products
Vendor | Product | Version | ||
---|---|---|---|---|
Qualcomm, Inc. | Snapdragon |
Version: FastConnect 6200 Version: FastConnect 6700 Version: FastConnect 7800 Version: QCC5161 Version: QCC710 Version: QCC711 Version: QCC7225 Version: QCC7226 Version: QCC7228 Version: QMP1000 Version: S3 Gen 2 Sound Platform Version: S3 Sound Platform Version: S5 Gen 2 Sound Platform Version: S5 Sound Platform Version: SM6475 Version: SM6650 Version: SM6650P Version: SM7435 Version: SM7550 Version: SM7550P Version: SM7635 Version: SM7635P Version: SM7675 Version: SM7675P Version: SM8635 Version: SM8635P Version: SM8735 Version: SM8750 Version: SM8750P Version: Snapdragon 6 Gen 1 Mobile Platform Version: WCD9370 Version: WCD9371 Version: WCD9375 Version: WCD9378 Version: WCD9385 Version: WCD9390 Version: WCD9395 Version: WCN3988 Version: WCN6650 Version: WCN6755 Version: WCN7750 Version: WCN7860 Version: WCN7861 Version: WCN7880 Version: WCN7881 Version: WSA8810 Version: WSA8815 Version: WSA8830 Version: WSA8832 Version: WSA8835 Version: WSA8840 Version: WSA8845 Version: WSA8845H |
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