{"vulnerability": "cve-2017-18157", "sightings": [{"uuid": "f8a9bc68-1873-4ef0-b156-7e594ca6e5ab", "vulnerability_lookup_origin": "1a89b78e-f703-45f3-bb86-59eb712668bd", "author": "9f56dd64-161d-43a6-b9c3-555944290a09", "vulnerability": "CVE-2017-18157", "type": "seen", "source": "https://t.me/cibsecurity/4137", "content": "ATENTION\u203c New - CVE-2017-18157\n\nA Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.\n\n\ud83d\udcd6 Read\n\nvia \"National Vulnerability Database\".", "creation_timestamp": "2019-05-07T02:53:13.000000Z"}]}