ID CVE-2019-2343
Summary Out of bound read and information disclosure in firmware due to insufficient checking of an embedded structure that can be sent from a kernel driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130
References
Vulnerable Configurations
  • cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:qualcomm_215:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:qualcomm_215:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_632:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_632:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_665_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_665_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_665:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_665:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_675:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_675:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_730:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_730:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_855:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_855:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_8cx:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_8cx:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sxr1130:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sxr1130:-:*:*:*:*:*:*:*
CVSS
Base: 2.1 (as of 24-08-2020 - 17:37)
Impact:
Exploitability:
CWE CWE-125
CAPEC
  • Infiltration of Hardware Development Environment
    An attacker, leveraging the ability to manipulate components of primary support systems and tools within the development and production environments, inserts malicious software within the hardware and/or firmware development environment. The infiltration purpose is to alter developed hardware components in a system destined for deployment at the victim's organization, for the purpose of disruption or further compromise.
  • Overread Buffers
    An adversary attacks a target by providing input that causes an application to read beyond the boundary of a defined buffer. This typically occurs when a value influencing where to start or stop reading is set to reflect positions outside of the valid memory location of the buffer. This type of attack may result in exposure of sensitive information, a system crash, or arbitrary code execution.
Access
VectorComplexityAuthentication
LOCAL LOW NONE
Impact
ConfidentialityIntegrityAvailability
PARTIAL NONE NONE
cvss-vector via4 AV:L/AC:L/Au:N/C:P/I:N/A:N
refmap via4
confirm https://www.qualcomm.com/company/product-security/bulletins
Last major update 24-08-2020 - 17:37
Published 25-07-2019 - 17:15
Last modified 24-08-2020 - 17:37
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