1. CVE-Search
  2. CVE-2017-18140
ID CVE-2017-18140
Summary In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.
References
Vulnerable Configurations
  • cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_400:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_400:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_617:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_617:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_808:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_808:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_810:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_810:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
CVSS
Base: 10.0 (as of 11-05-2018 - 18:11)
Impact:
Exploitability:
CWE CWE-416
CAPEC
Access
VectorComplexityAuthentication
NETWORK LOW NONE
Impact
ConfidentialityIntegrityAvailability
COMPLETE COMPLETE COMPLETE
cvss-vector via4 AV:N/AC:L/Au:N/C:C/I:C/A:C
refmap via4
bid 103671
confirm https://source.android.com/security/bulletin/2018-04-01
Last major update 11-05-2018 - 18:11
Published 11-04-2018 - 15:29
Last modified 11-05-2018 - 18:11
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