ID CVE-2017-18131
Summary In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016.
References
Vulnerable Configurations
  • cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm429:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm429:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm632:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm632:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
  • cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
    cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
  • cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
    cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
CVSS
Base: 7.2 (as of 07-05-2019 - 18:37)
Impact:
Exploitability:
CWE CWE-665
CAPEC
  • Leveraging Race Conditions
    The adversary targets a race condition occurring when multiple processes access and manipulate the same resource concurrently, and the outcome of the execution depends on the particular order in which the access takes place. The adversary can leverage a race condition by "running the race", modifying the resource and modifying the normal execution flow. For instance, a race condition can occur while accessing a file: the adversary can trick the system by replacing the original file with his version and cause the system to read the malicious file.
  • Leveraging Time-of-Check and Time-of-Use (TOCTOU) Race Conditions
    This attack targets a race condition occurring between the time of check (state) for a resource and the time of use of a resource. A typical example is file access. The adversary can leverage a file access race condition by "running the race", meaning that they would modify the resource between the first time the target program accesses the file and the time the target program uses the file. During that period of time, the adversary could replace or modify the file, causing the application to behave unexpectedly.
Access
VectorComplexityAuthentication
LOCAL LOW NONE
Impact
ConfidentialityIntegrityAvailability
COMPLETE COMPLETE COMPLETE
cvss-vector via4 AV:L/AC:L/Au:N/C:C/I:C/A:C
refmap via4
confirm https://www.qualcomm.com/company/product-security/bulletins
Last major update 07-05-2019 - 18:37
Published 06-05-2019 - 23:29
Last modified 07-05-2019 - 18:37
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